QFN (Quad Flat No Lead), with its package outline without lead span, QFB package profile is smaller than tradition package such as QFP and SSOP. Besides, the no lead span can also provide better electric and thermal performance than other traditional package. (shorter thermal dissipation path). DR-QFN (Dual rows QFN), within same package size, it can provide higher IO density then QFN ( X 1.5) in order to fulfill more complex chip functions.
As mentioned advantages incl. compact package size, better electrical and thermal performance. QF/DR-QFN can cope with tradition QFP package (lead count 48~128), and lower IO TFBGA (ball count 100~180). QFN/DR-QFN will be main stream package option gradually for consumer electronic products of nowadays. CWTC can provide below QFN lead frame SPEC.