SO (small outline) series is the combination of small outline package which includes SOP (small outline package), SSOP (Shrink SOP), TSOP (Thin SOP)and TSSOP (Thin Shrink SOP). SO is basically the derivate of DIP (Dual in-line package). It reduces space by approximately 30 to 50% compared to the equivalent DIP package and reduces thickness by approximately 70%. The characteristic of SO series package is having “gull wing” leads on two side of periphery. SO is also widely applied on numerous IC and flash and memory is the major application. CWTC can provide below SO series lead frame SPEC.