SO Series

SO(Small Outline)系列为DIP(Dual In-line Package)之延伸，泛指其面积较DIP少30~50%且厚度亦少于DIP的70%，其特点为引脚自封装两侧拉出成如海鸥翼(L字型)。同时，SO系指一种封装的组合，包含SOP(Small Outline Package)、SSOP(Shrink SOP)、TSOP(Thin SOP)及TSSOP(Thin Shrink SOP)等。 SO被广泛应用于各类型的IC，其中以随机记忆体及闪存储空间为最主流，本公司可提供的规格如下：

SOP

Lead Count No. of Row Pcs Per Strip Width Range Per Strip Length Range Per Strip Material Surface Treatment
8~48L 1~13row 14~468pcs 18.288~100mm 172.25~300mm A194/C7025/ A42/EFT64 Ag/PPF/Roughen PPF/Copper

TSOP

Lead Count No. of Row Pcs Per Strip Width Range Per Strip Length Range Per Strip Material Surface Treatment
20~86L 1~4row 16~40pcs 24.64~90mm 158~250mm A194/C7025 /A42 Ag/PPF/Roughen PPF

TSSOP

Lead Count No. of Row Pcs Per Strip Width Range Per Strip Length Range Per Strip Material Surface Treatment
8~86L 2~24row 32~960pcs 30.734~100mm 183.6~300mm A194/C7025 /EFT64 Ag/PPF/Roughen PPF/Copper
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