SO Series

SO(Small Outline)系列為DIP(Dual In-line Package)之延伸，泛指其面積較DIP少30~50%且厚度亦少於DIP的70%，其特點為引腳自封裝兩側拉出成如海鷗翼(L字型)。同時，SO係指一種封裝的組合，包含SOP(Small Outline Package)、SSOP(Shrink SOP)、TSOP(Thin SOP)及TSSOP(Thin Shrink SOP)等。SO被廣泛應用於各類型的IC，其中以隨機記憶體及閃存儲空間為最主流，本公司可提供的規格如下：

SOP

Lead Count No. of Row Pcs Per Strip Width Range Per Strip Length Range Per Strip Material Surface Treatment
8~48L 1~13row 14~468pcs 18.288~100mm 172.25~300mm A194/C7025/ A42/EFT64 Ag/PPF/Roughen PPF/Copper

TSOP

Lead Count No. of Row Pcs Per Strip Width Range Per Strip Length Range Per Strip Material Surface Treatment
20~86L 1~4row 16~40pcs 24.64~90mm 158~250mm A194/C7025 /A42 Ag/PPF/Roughen PPF

TSSOP

Lead Count No. of Row Pcs Per Strip Width Range Per Strip Length Range Per Strip Material Surface Treatment
8~86L 2~24row 32~960pcs 30.734~100mm 183.6~300mm A194/C7025 /EFT64 Ag/PPF/Roughen PPF/Copper
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